The TEEAP Journal

The TEEAP Journal is the official publication of the Technology & Engineering Education Association of Pennsylvania. It is published quarterly (Spring, Summer, Fall, Winter). Every active member of the organization receives a copy of the TEEAP Journal which is included in the cost of their annual membership.

This page not only includes links to some featured articles, but also details on how to submit article for publication as well as how to have your products and services advertised.

Click HERE to jump to the Featured Articles.

Article Submission Process
the TEEAP Journal welcomes original articles, which may be submitted  via email, a 3.5 inch diskette, CD-R or CD-RW in Microsoft Word or text format. TIFF format files are preferred for photo, artwork, and ads. Submission Deadlines:

  • Spring (March 10), Summer (May 10), Fall (Sept. 10), Winter (Nov. 10)

Advertising Information
The TEEAP Journal is mailed to nearly 2,000 Technology Education teachers, supervisors, administrators, teacher educators and future teachers in Pennsylvania and surrounding states. For advertising rates and requirements for the TEEAP Journal, contact:

Forward articles to:
Dr. Laura Hummell, Editor
TEEAP Journal
Email

Contact for Advertising Opportunities:
Lisa Lathom, Advertising Manager
TEEAP Journal

Email

 

Featured Articles

The editor of the TEEAP Journal has provided a number of articles for posting on our website to spread awareness of who we are and what we do as a profession and as an organization. Please take some time to read the articles listed below. Some of the articles deal with some very important issues facing our profession today, such as the need for more women in technology education as well as the Technology Education Teacher shortage we are facing.

Articles will open in separate browser window, please be sure to disable any Pop-Up blockers in order to view the articles below...
 

Engineering by Design

Pennsylvania is a member state of the ITEEA's STEM Center for Teaching & Learning Consortium through partnership with California Univ. of PA, Millersville Univ., PA Dept. of Environmental Protection, the TEEAP and the Delaware Valley Industrial Resource Center (DVIRC). Schools across PA have free access to Engineering byDesign™ products. If you are interested in accessing it you need to accept the Licensing & Distribution Agreement and fill out the web form by clicking here. Once your request is received the URL to the PA page will be sent to you. 

2012 TEEAP Conference

Thank you to everyone who attended the 2011 TEEAP Conference! We encourage you to consider presenting at next year's conference on November 8-9, 2012. Visit our Conference page for some information concerning the 2011 Conference as well as the form to sign up to present at next year's conference. Information for the 2012 Conference will be available during late June or early July of 2012.

Join TEEAP's Online Network

Join TEEAP online networking services to stay on top of news, information, and opportunities. TEEAP can currently be found on:

ITEEA in Columbus 2013

The theme ITEEA's 75th Annual Conference is Improving Technology & Engineering for All Students: A Plan of Action. As ITEEA starts its 75th Anniversary celebration of its past, present, and future, there are guiding principles that will shape our field and the content to be taught. We know that the pace of innovation will continue to be rapid and globally interconnected. The population of individuals who are involved with or affected by technology will be increasingly diverse and multidisciplinary. Social, cultural, political, and economic forces will continue to shape and affect the success of innovation. The presence of technology in our every day lives.

This conference is an opportunity to recognize and honor the accomplishments of our colleagues and best-practice programs. Additionally, it provides professional development and networking opportunities, as well as opportunity to renew old friendships and create new friendships. For more information, click here.